Lift-off resists

JSR LP series for lift-off applications is especially designed to offer large undercut profiles for an easy stripping after metal deposition.

•2-4µm film thickness
•Highly tunable profiles with very large undercuts
•Fast and easy stripping at room temperature
•Excellent resolution with no pattern collapse

    Profile control

      Among others, the PEB temperature and the focus offset are two efficient knobs to tune the pattern profile.



        Submicron resolution with very tapered profile can be obtained with no pattern collapse.

Example with Cu deposition process

Disclaimer : The data presented on this page are an indication on JSR products and their performances, which may differ with process conditions.