JSR’s THB series focuses on the formation of various metallic features through electroplating. Excellent resolution and resistance to plating chemistries provide a versatile platform to create various aspect ratios of microbumps, RDLs, pillars, …
THB photoresists features:
Below is a schematic overview of JSR plating photoresists, spanning a wide range of thicknesses and aspect ratios.
Focus on products
Focus on C4 bump / Cu pillars photoresist
Focus on positive-tone plating resist
Below is an overview of JSR fast positive-tone plating resist with excellent process window and versatility.
Disclaimer : The data presented on this page are an indication on JSR products and their performances, which may differ with process conditions.