JSR Micro manufactures the industry's most innovative family of photoresists, hardmasks, and speciality chemicals to tackle all lithographic challenges - from non-critical i-line to multi-patterning approaches. Please select from the list to the left for more information on a specific product line.

• Leading edge lithography
• Robust process latitude
• Low defectivity
• Excellent quality control
• Low LWR
• Low MEEF
• Enhanced resolution to extend CoO of existing tool sets

ArF dry lithography - L/S

LWR improvement

ARX series - 60nm L/S - ASML /1400 (0.93NA)

High-Speed ArF Photoresist

• Low LWR
• Low defectivity
• Low MEEF (mask error enhancement factor)

JSR ArF Immersion Photoresist with Dual HM

JSR ArF Non-Topcoat Immersion Photoresist

Why EUV?

The need to increase resist resolution, while keeping sensitivity (dose) low, and minimizing LWR and LCDU - simultaneously. 

One solution is moving from ArF to EUV

Multilayer results: 42nm 1:1

JSR I-line photoresists

With about four decades of experience in i-line photochemistry, JSR is proud to offer its customers a comprehensive line-up in both positive and negative tonalities.

Always at the forefront of innovation in photoresist design to keep up with ever more demanding requirements from the industry, JSR recently introduced two new specialty grades respectively targeting high throughputs and outstanding wet-etching resistance.

JSR i-line portfolio is divided into versatile, all-around grades with various levels of photospeeds and specialty grades tailored for advanced and demanding processes. JSR offers products with several viscosities targeting the following applications:

• Wet and dry-etching
• Non-critical and critical dimensions
• Highly reflective and non-standard substrates
• Implantation
• Low outgas
• Lift-off
• High throughput

Positive-tone overview

Below is a simplified overview of JSR positive tone i-line grades, spanning diverse applications as indicated by the colour code.

Negative-tone overview

The following chart summarizes JSR negative-tone i-line grades, especially suitable for high energy implantation/dry etching resistance, with very low outgas.

Focus on products

Focus on IX1025L - high resolution for CD-critical applications

IX1025L targets CD-critical applications with a large process window, as depicted below.

Focus on IX160L - high adhesion for wet etch applications

IX160L was especially developed to offer high adhesion whilst keeping high resolution. Below is a comparison of the resistance to bHF etching between IX160L and standard i-line resists. More data available in the folder.

Disclaimer : The data presented on this page are an indication on JSR products and their performances, which may differ with process conditions.

JSR KrF photoresists

Since JSR started developing photoresists on the KrF platform in the 1980s, emphasis has always been placed on quality and performance. It remains at the heart of our activities as we keep on developing new formulations to address the newest market needs in 248nm sensitive photoresists.

JSR prides itself on proposing a broad lineup of KrF grades with the following properties:

•Environmentally Stable Chemically Amplified Photoresists (ESCAP) with positive tonality

•Low blob defectivity

•High throughput

•Multiple purpose grades

The following sections highlights some of JSR's portfolio through an overview of :

• line/space grades overview,
• contact/hole grades overview,
• focus on M91Y as a multipurpose photoresist, 
• focus on M230Y for high resolution,
• focus on M170Y for critical contact/hole applications

Feel free to contact us for specific requests that may not be addressed on this page.

Line/Space grades overview

Below is an overview of the main L/S grades proposed by JSR.

Contact/hole grades overview

Below is an overview of the main C/H grades proposed by JSR.

Focus on products

Focus on M91Y

          M91Y is a multipurpose photoresist designed for the 180nm node and above. It is suitable both for L/S and C/H applications.

1. L/S performance for various densities and CDs.

2. C/H performance for various densities and CDs.

Focus on M230Y

M230Y targets CD-critical applications for 110nm technology nodes and even offers a wide process windows at 95nm CD.     

Focus on M170Y

M170Y was especially designed for CD-critical contacts/holes applications.

1. Focus latitude for 150nm dense C/H.

2. Focus latitude for 160nm dense and isolated C/H.

Disclaimer : The data presented on this page are an indication on JSR products and their performances, which may differ with process conditions.

JSR's unique THB series of plating photoresists and WPR series of dielectric materials are ideal for next generation WL-CSP (wafer level chip scale packaging) technologies that facilitate higher performance. 

Our THB series address the needs of metal plating and bumping processes. Excellent plating tolerance and ease of stripping allow for fast processing with good throughput and superior process margins. THB materials are developable in standard TMAH yielding high aspect ratio profiles for film thicknesses from 5 to 200 microns.

JSR's WPR is a thick photosensitive dielectric that is ideal for redistribution layers, stress buffer layers and passivation. Available in positive and negative tone, WPR is patternable and aqueous developable with low residual stress and cure temperature.

JSR’s PFAS-free dielectrics include both photosensitive and non-photosensitive materials, for a wide range of film thicknesses and applications such as passivation, adhesion, or RDL insulation.

JSR dielectrics series features:

• High photosensitivity
• Excellent adhesion on SiN, SiO2, …
• Low cure temperature
• Low residual stress and shrinkage
• Excellent chemical resistance
• Low Dk and Df for 5G applications

For further information, please contact us.

JSR LP series for lift-off applications is especially designed to offer large undercut profiles for an easy stripping after metal deposition.

• 2-4µm film thickness
• Highly tunable profiles with very large undercuts
• Fast and easy stripping at room temperature
• Excellent resolution with no pattern collapse

Profile control

Among others, the PEB temperature and the focus offset are two efficient knobs to tune the pattern profile.

Resolution

Submicron resolution with very tapered profile can be obtained with no pattern collapse.

Example with Cu deposition process

Disclaimer : The data presented on this page are an indication on JSR products and their performances, which may differ with process conditions.

JSR’s THB series focuses on the formation of various metallic features through electroplating. Excellent resolution and resistance to plating chemistries provide a versatile platform to create various aspect ratios of microbumps, RDLs, pillars, …

THB photoresists features:

• Low outgas
• Excellent plating performances
• Standard development with TMAH
• Excellent process windows
• Low bubble amounts, even at high film thickness
• Excellent environmental tolerance

Products overview

Below is a schematic overview of JSR plating photoresists, spanning a wide range of thicknesses and aspect ratios.

Focus on products  

Focus on C4 bump / Cu pillars photoresist 

JSR negative-tone photoresists for C4 bumping/Cu pillars plating are designed for plating thick structures with high aspect ratios whilst keeping a wide process  window.

Focus on positive-tone plating resist

Below is an overview of JSR fast positive-tone plating resist with excellent process window and versatility.

Disclaimer : The data presented on this page are an indication on JSR products and their performances, which may differ with process conditions.