JSR Micro produces an advanced range of photoresists, hardmasks, and speciality chemicals designed to address every lithographic challenge, from non-critical i-line to complex multi-patterning techniques.

With nearly 40 years of expertise in i-line photochemistry, JSR offers a comprehensive range of positive and negative tone photoresists. Continuously innovating to meet industry demands, JSR recently introduced two specialty grades—one for high throughput and another for exceptional wet-etching resistance.

The i-line portfolio includes versatile all-purpose grades with varying photo speeds and specialty grades for advanced applications. JSR provides products in multiple viscosities for:

• Wet and dry etching

• Critical and non-critical dimensions

• Highly reflective and non-standard substrates

• Implantation

• Low outgassing

• Lift-off

• High throughput

Positive-tone overview

Below is a simplified overview of JSR positive tone i-line grades, spanning diverse applications as indicated by the color code.

Negative-tone overview

The following chart summarizes JSR negative-tone i-line grades, especially suitable for high energy implantation/dry etching resistance, with very low outgas.

Since JSR began developing photoresists on the KrF platform in the 1980s, quality and performance have remained our top priorities. We continue to innovate, formulating advanced 248nm-sensitive photoresists to meet evolving market demands.

JSR offers a diverse lineup of KrF grades featuring:

• Environmentally Stable Chemically Amplified Photoresists (ESCAP) with positive tonality

• Low blob defectivity

• High throughput

• Versatile, multi-purpose grades

Line/Space grades overview

Below is a simplified overview of JSR positive tone L/S grades, targeting diverse applications as indicated by the color code.

Contact/Hole grades overview

Below is a simplified overview of JSR positive tone C/H grades, targeting diverse applications as indicated by the color code.

JSR also offers a diverse range of ArF Dry & Immersion resists designed for multiple applications, featuring the following properties.

• Leading edge lithography

• Robust process latitude

• Low defectivity

• Excellent quality control

• Low LWR

• Low MEEF

• Enhanced resolution to extend CoO of existing tool sets    

Line/Space grades overview

Contact/Hole grades overview

To keep up with its scaling needs, the semiconductor manufacturing industry moved from ArF to EUV lithography at end of the 2010s. JSR has a comprehensive portfolio of advanced EUV photoresists already available, with continuous development ongoing to support emerging needs. Our products are designed to achieve higher pattern resolution while maintaining a low dose, minimizing roughness, and ensuring excellent CD uniformity.

JSR's unique THB series of plating photoresists and WPR series of dielectric materials are ideal for next generation WL-CSP (wafer level chip scale packaging) technologies that facilitate higher performance. 

Our THB series address the needs of metal plating and bumping processes. Excellent plating tolerance and ease of stripping allow for fast processing with good throughput and superior process margins. THB materials are developable in standard TMAH yielding high aspect ratio profiles for film thicknesses from 5 to 200 microns.

JSR's WPR is a thick photosensitive dielectric that is ideal for redistribution layers, stress buffer layers and passivation. Available in positive and negative tone, WPR is patternable and aqueous developable with low residual stress and cure temperature.

JSR’s THB series focuses on the formation of various metallic features through electroplating. Excellent resolution and resistance to plating chemistries provide a versatile platform to create various aspect ratios of microbumps, RDLs, pillars, …

THB photoresists features:

• Low outgas
• Excellent plating performances
• Standard development with TMAH
• Excellent process windows
• Low bubble amounts, even at high film thickness
• Excellent environmental tolerance

Products overview

Below is a schematic overview of JSR plating photoresists, spanning a wide range of thicknesses and aspect ratios.

Focus on products  

Focus on C4 bump / Cu pillars photoresist

JSR negative-tone photoresists for C4 bumping/Cu pillars plating are designed for plating thick structures with high aspect ratios whilst keeping a wide process  window.

Focus on positive-tone plating resist

Below is an overview of JSR fast positive-tone plating resist with excellent process window and versatility.

JSR’s PFAS-free dielectrics include both photosensitive and non-photosensitive materials, for a wide range of film thicknesses and applications such as passivation, adhesion, or RDL insulation.

JSR dielectrics series features:

• High photosensitivity
• Excellent adhesion on SiN, SiO2, …
• Low cure temperature
• Low residual stress and shrinkage
• Excellent chemical resistance
• Low Dk and Df for 5G applications

Products overview

JSR LP series for lift-off applications is especially designed to offer large undercut profiles for an easy stripping after metal deposition.

• 2-4µm film thickness
• Highly tunable profiles with very large undercuts
• Fast and easy stripping at room temperature
• Excellent resolution with no pattern collapse

Profile control

Among others, the PEB temperature and the focus offset are two efficient knobs to tune the pattern profile.

Resolution

Submicron resolution with very tapered profile can be obtained with no pattern collapse.

Example with Cu deposition process

Disclaimer : The data presented on this page are an indication on JSR products and their performances, which may differ with process conditions.