Packaging Materials

JSR's unique THB series of negative tone resists and WPR series of dielectric materials are ideal for next generation WL-CSP (wafer level chip scale packaging) technologies that facilitate higher performance.

Our THB series of negative tone resists address the needs of metal plating and bumping processes. Excellent plating tolerance and ease of stripping allow for fast processing with good throughput and superior process margins. THB cross-links on exposure and is developable in standard TMAH yielding high aspect ratio profiles for film thicknesses from 5 to 200 microns.

JSR's WPR is a thick photosensitive dielectric that is ideal for redistribution layers, stress buffer layers and passivation. Available in positive and negative tone, WPR is patternable and aqueous developable with low residual stress and cure temperature.